LFPAK56

LFPAK56 MOSFETs - LFPAK56 | Nexperia

Nexperia’s LFPAK56 portfolio gives industry leading performance in a truly innovative package. 100 % compatible with industry-standard Power-SO8 footprints, the design and construction is optimized to give the best thermal and electrical performance, cost and reliability.

Documentation

文件名称	标题	类型	日期
AN11158	Understanding power MOSFET data sheet parameters	Application note	2020-07-06
nexperia_document_leaflet_LFPAK56_LR_2020	The automotive Power-SO8 that packs a punch	Leaflet	2020-04-22
nexperia_document_leaflet_LFPAK56_CHN_2020	LFPAK56 车规级Power-SO8性能强劲	Leaflet	2020-05-01
AN90003	LFPAK MOSFET thermal design guide	Application note	2021-01-22
Nexperia_package_poster	Nexperia package poster	Leaflet	2019-03-01
AN90016	Maximum continuous currents in NEXPERIA LFPAK power MOSFETs	Application note	2020-09-03
AN90019	LFPAK MOSFET thermal resistance - simulation, test and optimization of PCB layout	Application note	2020-07-20

Thermal performance

No wires, no glue
175 °C Tj?max

Electrical performance

Low package resistance and inductance
Current handling up to 100 A

Cost

Fewer manufacturing steps means cost-effective, high volume production

Mechanical Robustness

Exposed leads absorb thermal and mechanical stresses

Manufacturability

Easy optical inspection of solder joints
Low package height
Wave solderable

Compatibility

100 % compatible with industry-standard footprints

Innovative clip-bonding

Unlike competitor Power-SO8 types which are constructed using wire bonding, Nexperia’s LFPAK56 uses a copper clip which is soldered in a single operation to the gate and source. This reduces spreading resistance, and gives LFPAK56 superior electrical and thermal characteristics as well as increased reliability.

Resists mechanical and thermal stress

Customer feedback consistently shows that LFPAK56 is more reliable and rugged than competitor QFN and other micro-lead devices. The LFPAK56 meets full automotive qualification (AEC-Q101), clear proof of its superior ruggedness and reliability in the toughest conditions. LFPAK’s innovative construction allows the gate and source pins to ‘flex’ and safely absorb the mechanical stresses that occur when a device is rapidly heated and cooled.

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Soldering and footprint compatibility

There are many power MOSFETs available in the Power-SO8 family. However as there is no generic JEDEC standard for Power-SO8 devices, each device generally has a different PCB footprint and none of the manufacturer’s devices are guaranteed to be interchangeable with other devices. LFPAK56 achieves electrical and mechanical compatibility with industry-standard footprints, as shown below.